PCB回路基板：16層PCB - PCBサンプル

PRODUCT PICTURE
Dongguan Yaocheng Electronic Technology Co., Ltd.

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会社概要
Dongguan Yaocheng Electronic Technology Co., Ltd.

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Dongguan Yaocheng Electronic Technology Co., Ltd. is a wholly-owned Hong Kong company (Weiyuanda Industrial Co., Ltd), which provides global PCB fast proofing, small and medium batch circuit board production and manufacturing enterprises. The factory is located in Chang’an, Dongguan, just one bridge to Shenzhen Apart. The factory has a construction area of 10,000 square meters, a monthly production capacity of 20,000 square meters, and a monthly production of up to 5,000 varieties. Committed to becoming a world-class service provider for medium and small batch circuit boards and model brands of circuit boards.

Certifications
Dongguan Yaocheng Electronic Technology Co., Ltd.

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TRADE INFORMATION
東莞耀誠電子科技有限公司。

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FAQ
東莞耀誠電子科技有限公司。

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コンピテンシー：
Monthly output Capacity: 5,000 sqM for Multilayer
階数：2～30階
Products Type:
FR4 、HF (High Frequency) & RF (Radio Frequency) board, Impedance controlled board 

材料：
Laminate:  FR4 
HF材料：；Rogers、Taconic、Arlon
高TG材料： ；ITEQ/IT 180と関連PP
ハロゲンフリー材料：、聖衣/S 1155/S 1165
Solder Mask:  Taiyo PSR 2000/4000
Plating Chemistry:  ROHM & HASS

表面仕上げ：
Leaded HAL, Lead free HAL, ENIG, OSP (Entek), Immersion Tin,
Immersion Silver, Hard Gold(50u")

Selective Surface Treatment:
ENIG + OSP, ENIG + Gold Fingers, Immersion Silver + Gold Fingers,
Immersion Tin + Gold Fingers

Technical Specification
Min. Trace Width/Space: 3/3mil (outer layer, finished copper 30um), 2.5/2.5mil(inner layer, 1/3 or 1/2 OZ)
Min. Hole Size: 0.15mm/6mil (mechanical drill), 0.1mm/4mil (laser drill)
最小リング：4ミル
Min. Distance Between Layers: 2mil
Max. Finished Copper Thickness: 7 OZ
Max. Finished Board Size: 600X800mm / 23.5"*32.5"
完成品の板厚：；両面：0.2-7.0 mm/0.008"-0.28"、多層：0.40-7.0 mm/0.016"-0.28"、
最小溶接マスクブリッジ：≥0.08 mm
Aspect ratio: 16:1
貫通孔を塞ぐ能力：0.2-0.8 mm

許容差:
めっき孔公差：±0.075 mm（最小値±0.05）
Non-plated hole tolerance: ±0.05mm (min+0/-0.05mm or +0.05/-0mm)
Outline Tolerance: ±0.1mm(mils±0.05-0.075mm)

機能テスト：
Insulation Resistance: 50 ohms (standard)
Peel Off Strength: 1.4N/mm
Thermal Shock Test: 280 degrees F, 20 seconds
Solder Mask Hardness: ≥6H
E試験電圧：10 V-250 V
ツイストとツイスト:≤0.7%

資格認定：
ISO、UL、ISO9001、ISO14001、UL